IPC Components

POWERFUL BOARD FOR FANLESS APPLICATIONS

Automated processes are taking up more and more space in our everyday lives. Embedded boards are at the heart of many applications, such as self-driving logistics systems or camera-controlled handling robots, which process information quickly and reliably independently of humans. For these applications, fanless and thus low-maintenance solutions are particularly well suited.

 

The 3.5" embedded boards of the LE-37O series from Spectra offer you outstanding performance with the powerful Intel® Tiger Lake UP3 processors. With them you achieve up to 23% higher single-thread and up to 19% higher multi-thread performance compared to 8th generation Intel® Core™ processors.

 

Due to the low TDP value of only 15 W, the boards of the LE-370 series are very well suited for the construction of compact and fanless embedded systems.

To adapt the performance exactly to your requirements, choose between an Intel® Core™ i7-1185G7E and a Celeron® 6305E processor. The processors are supported by DDR4 memory, which you can expand up to 32GB. And you can easily connect mass storage via two SATA ports.

 

High graphics performance is provided by the Intel® Iris® Xe Graphics GPU, which enables the connection of up to four independent displays in 4K quality via LVDS, HDMI, VGA and DP port.
Connect external peripherals via four USB 3.2 Gen 2 and two USB 2.0 ports. And two Gigabit Ethernet ports are available for wired network connections. Functions such as Wi-Fi or Bluetooth are easy to retrofit thanks to two M.2 slots and an mPCIe slot.

 

The wide input voltage range of 9 to 35VDC and the operating temperature of 0°C to 60°C support use in industrial environments.

1 products
1 products

LE-37O

3.5" Embedded Board with Tiger Lake Processor

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